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浅谈电镀工艺的分类及工艺流程,烤漆房常识

文章发布: 发表时间: 2017-05-22 10:05:30

电镀技术广泛运用在国民出产的各个领域,只有认真操作才干有用节约能源、保护环境。在以下简略先容一下有关电镀技术的一些根本常识。电镀技术的分类:酸性亮光铜电镀电镀镍/金电镀锡。
Electroplating technology is widely used in various fields of national production. Only by careful operation can we effectively save energy and protect the environment. Here is a brief introduction to some basic knowledge of electroplating technology. Classification of plating technology: acid bright copper plating, nickel plating / tin plating.
技术流程:浸酸全板电镀铜酸性除油微蚀浸酸镀锡浸酸图形电镀铜镀镍浸柠檬酸镀金。
Technological process: dip acid, full plate, electroplating copper, acid degreasing, micro corrosion pickling, tin plating, acid dipping pattern, electroplated copper, nickel plated, citric acid plated gold plating.
流程说明。
Process description.
(1)浸酸。
(1) pickling.
①作用与意图:除掉板面氧化物,活化板面,通常浓度在5~10左右,首要是避免水分带入形成槽液硫酸含量不稳定。
Action and intention: remove the plate oxide, activate the surface, usually at about 5~10 concentration, mainly to avoid moisture into the formation of liquid, sulfuric acid content instability.
②运用C.P级硫酸,酸浸时刻不宜太长,避免板面氧化;在运用一段时刻后,酸液呈现污浊或铜含量太高时应及时替换,避免污染电镀铜缸和板件外表。
The use of C.P sulfuric acid, pickling time should not be too long, to avoid oxidation of the surface; after the use of a period of time, the acid is dirty or copper content is too high, should be replaced in a timely manner, to prevent pollution of electroplating copper cylinder and board appearance.
(2)全板电镀铜。
(2) full plate copper plating.
①作用与意图:保护刚刚沉积的薄薄的化学铜,避免被酸浸蚀掉,经过电镀将其加后到必定程度。
Action and intention: protect the thin chemical copper that has just been deposited, avoid being eroded by acid, and add it to a certain level after plating.
②全板电镀铜有关技术参数:槽液首要成分有硫酸铜和硫酸,选用高酸低铜配方,保证电镀时板面厚度散布的均匀性和对深孔的深镀才能;硫酸含量多在180到240克/升;硫酸铜含量通常在75克/升左右,槽液中可有微量的氯离子,作为辅佐光泽剂和铜光剂共同表现光泽作用;铜光剂的增加量在3~5ml/L,铜光剂的增加通常依照千安小时的方法或许依据实践出产板作用来弥补;全板电镀的电流通常按2安/平方分米乘以板上可电镀面积核算;铜缸温度通常操控在22~32度。
The relevant technical parameters of the full plate electroplating copper: main component bath with copper sulfate and sulfuric acid, high low acid copper electroplating plate thickness formula, to ensure the uniformity and dispersion of deep deep plating ability; sulfate content in 180 to 240 Ksson; the content of copper sulfate usually in about 75 Ksson, bath a trace of chloride as adjuvant agent and shiny copper agent common gloss effect; increase the amount of copper agent in 3 ~ 5ml/L, increased copper agent is usually in accordance with the method kiloampere hours may according to the practice in production to make up for the role; full plate electroplating current usually in 2 / square. Decimeter plate can be multiplied by plating area calculation; copper cylinder temperature control in 22 ~ 32 degrees usually.
③技术保护:每日依据千安小时来及时弥补铜光剂;查看过滤泵是不是作业正常;每隔2-3小时运用洁净的湿抹布将阴极导电杆擦拭洁净;每周要定时剖析并经过霍尔槽实验来调整光剂含量及时弥补;每周要清洁阳极导电杆,槽体两头电接头,及时弥补钛篮中的阳极铜球;每月应查看阳极的钛篮袋有无破损并及时替换;并查看阳极钛篮底部是不是堆积有阳极泥;每半年左右具体依据槽液污染情况决定是不是需求大处理;每两周要替换滤泵的滤芯。
The technical protection: daily basis kiloampere hours to make up copper agent; check the filter pump is not normal operation; every 2-3 hours use wet cloth clean the cathode conducting rod wipe clean; and after a week the timing analysis of Holzer cell experiments to adjust light agent content timely supplement; every week to clean the anode pole. The two electric connectors, make up titanium anode copper ball basket; titanium basket bag check monthly anode without damage and timely replacement; and view the anode titanium basket bottom is not the accumulation of anode slime; every half a year according to the bath pollution decision is not demand processing; filter every two weeks replace the filter pump.
④阳极铜球内含有少数的磷,意图是下降阳极溶解功率,削减铜粉产生。
The anode copper ball contains a small amount of phosphorus, which is intended to reduce the anode dissolution power and to reduce copper powder.
⑤弥补药品时,如增加量较很多硫酸铜或硫酸时,应分几回缓慢补加;否则会形成槽液温度过高,光剂分解加速,污染槽液。
When the medicine is added, if the amount of copper is increased more than that of copper sulfate or sulfuric acid, it should be slowly added several times. Otherwise, the temperature of the tank will be too high, the decomposition of the reagent will be accelerated, and the contamination bath liquid will be accelerated.
(3)酸性除油。
(3) acid deoiling.
①意图与作用:除掉线路铜面上的氧化物,保证一次铜与图形电镀铜或镍之间的结合力。
Intention and function: to remove the oxide on the copper surface of the copper line, and to ensure the bonding force between copper and copper or nickel.
②运用酸性除油剂,出产时只需操控除油剂浓度和时刻即可。
The use of acidic degreasing agent, production only need to control the concentration and time of degreasing agent.
(4)微蚀。
(4) slight corrosion.
①意图与作用:清洁粗化线路铜面,保证图形电镀铜与一次铜之间的结合力。
Intention and function: clean the copper surface of the rough copper line, and ensure the bonding power between the copper and copper.
②微蚀剂选用过硫酸钠。
The micro inhibitor with sodium persulfate.
(5)浸酸。
(5) pickling.
①作用与意图:除掉板面氧化物,避免水分带入形成槽液硫酸含量不稳定。
Action and intention: remove the oxide from the plate and avoid the water flowing into the bath. The sulphuric acid content is unstable.
②运用C.P级硫酸酸浸,时刻不宜太长,避免氧化。
The use of C.P sulfuric acid leaching, the time should not be too long, to avoid oxidation.
(6)图形电镀铜,又名二次铜。
(6) graphic copper plating, also known as the two copper.
意图与作用:为满意各线路额外的电流负载,各线路和孔铜需求到达必定的厚度,线路镀铜即是将孔铜和线路铜加厚到必定的厚度。
Intention and function: in order to satisfy the additional current load of each line, the copper demand of each line and hole reaches the certain thickness; the copper plating on the line is to thicken the hole copper and the line copper to the certain thickness.
   (7)电镀锡。
(7) tin plating.
①意图与作用:图形电镀纯锡意图是用纯锡单纯作为金属抗蚀层,保护线路蚀刻。
Intent and function: the purpose of electroplating pure tin is to use pure tin as a metal resist to protect the line etching.
②槽液首要由硫酸亚锡,硫酸和增加剂构成;硫酸亚锡含量操控在35克/升左右,硫酸操控在10左右;镀锡增加剂的增加通常依照千安小时的方法来弥补或许依据实践出产板作用;电镀锡的电流核算通常按1.5安/平方分米乘以板上可电镀面积;锡缸温度维持在室温状况,通常操控在22~30度,因此在夏日因温度太高可加装冷却温控体系。
The bath is mainly composed of stannous sulfate, sulfuric acid and additives; stannous sulfate content in the control of around 35 g / L, sulfate control in about 10; increase the tin usually increase agent method according to an hour to make up for thousands of may according to the practice production board; tin plating current accounting usually by 1.5 / square. Decimeter plate can be multiplied by the plating area; maintain tin cylinder at room temperature, usually control in 22 ~ 30 degrees, so in the summer because the temperature is too high the cooling temperature control system.
③技术保护:每日依据千安小时来及时弥补镀锡增加剂剂;查看过滤泵是不是作业正常;每个2~3小时运用洁净的湿抹布将阴极导电杆擦拭洁净;每周要定时剖析并经过霍尔槽实验来调整镀锡增加剂含量;每周要清洁阳极导电杆,槽体两头电接头;每月查看阳极袋有无破损并及时替换;并查看阳极袋底部阳极泥;每两周要替换过滤泵的滤芯。
The technical protection: daily basis of thousands of hours to make up an increase of tin agent; check filter pump is not normal operation; every 2 ~ 3 hours use wet cloth clean the cathode conducting rod wipe clean; and after a week the timing analysis of the Holzer cell test to adjust the tin increase agent content; every week to clean the anode the two pole electrical connector; monthly check anode bag is damaged and replaced in time; the bottom of the bag and view the anode anode slime; filter every two weeks to replace the filter pump.
④弥补药品时进程同上,不再胪陈。
The drugs make up at the process above, no longer in detail.
(8)镀镍。
(8) nickel plating.
①意图与作用:镀镍层首要作为铜层和金层之间的阻隔层,避免金铜相互浸透,影响板子的可焊性和运用寿命;一起有镍层打底也大大增加了金层的机械强度。
The intention and effect: the primary nickel layer as barrier layer between the copper layer and the layer of gold, gold and copper to avoid mutual penetration, influence board weldability and service life; together with a nickel layer backing has greatly increased the mechanical strength of the gold layer.
②全板电镀铜有关技术参数:镀镍增加剂的增加通常依照千安小时的方法来弥补或许依据实践出产板作用,增加量大概200ml/KAH;图形电镀镍的电流核算通常按2安/平方分米乘以板上可电镀面积;镍缸温度维持在40~55度之间。
The relevant technical parameters of the full plate electroplating copper plating agent: increase usually increase in accordance with the method to make up for an hour thousands may according to the practice of production in effect, increase the amount of about 200ml/KAH; the current accounting pattern of nickel plating is usually at 2 ANN / square decimeter plate can be multiplied by the plating area; maintain nickel cylinder temperature between 40 ~ 55 degree.
③技术保护:每日依据千安小时来及时弥补镀镍增加剂;查看过滤泵是不是作业正常;每个2~3小时运用洁净的湿抹布将阴极导电杆擦拭洁净;每周要定时剖析并经过霍尔槽实验来调整镀镍增加剂含量及时弥补;每周要清洁阳极导电杆,槽体两头电接头,及时弥补钛篮中的阳极镍角,用低电流电解6~8小时;每月应查看阳极的钛篮袋有无破损并及时替换;并查看阳极钛篮底部是不是堆积有阳极泥;每两周药替换过滤泵的滤芯。
The technical protection: daily basis of thousands of hours to make up an increase of nickel plating agent; check the filter pump is not normal operation; every 2 ~ 3 hours use wet cloth clean the cathode conducting rod wipe clean; and after a week the timing analysis of Holzer cell experiments to adjust the nickel increase agent content to make up for a week to clean the anode; the two pole electrical connector, make up the angle of nickel titanium anode basket, with a low current electrolysis for 6 to 8 hours per month; titanium anode basket bag check without damage and timely replacement; and see is not the product of titanium anode mud heap at the bottom of the filter basket; every two weeks to replace the drug pump filter.
⑤弥补药品时进程同上,不再胪陈。
The drugs make up at the process above, no longer in detail.
(9)电镀金:分为电镀硬金和水金技术,槽液构成根本一致,硬金槽内多了一些微量金属镍、钴、铁等元素。
(9) electric gilding: divided into electroplated hard gold and water gold technology, the composition of bath liquid is basically the same. There are some trace metals such as nickel, cobalt, iron and other elements in the hard gold tank.
①意图与作用:金是贵金属,具有可焊性、耐氧化性、抗蚀性、触摸电阻小、合金耐磨性好等特色。
The intention and effect: gold metal is a precious one, solderability, oxidation resistance, corrosion resistance, touch small resistance and good wear resistance characteristics of alloy.
②线路板电镀金首要为柠檬酸金槽浴,保护简略,操作方便。
The gold plating on the circuit board is mainly made of citric acid gold bath. The protection is simple and the operation is convenient.
③水金金含量操控在1克/升左右,pH值4.5左右,温度35左右。
The content of water, gold and gold was controlled at 1 g / L, and the pH value was about 4.5, and the temperature was about 35.
④首要增加药品有酸式调整盐、碱式调整盐、导电盐、镀金弥补增加剂以及金盐等。
The first increase in drug acid salt, salt, adjust the basic adjustment of conductive salt, salt and other agents and to compensate for the increase in gold.
⑤金板电镀后运用纯水洗作为回收水洗,一起也可用来弥补金缸蒸腾改变的液位。
After plating, the gold plate is washed with pure water, which can be used for recovery and washing. It can also be used to make up the liquid level of the transpiration of the gold cylinder.
⑥金缸应选用镀铂钛网做阳极。
The gold cylinder should choose platinum plated titanium mesh anode.
⑦金缸有机污染运用碳芯接连过滤,并弥补适当镀金增加剂。
The gold cylinder organic pollution by using carbon core for filtering, and make appropriate gold-plated additives.

 

 

 

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